The paper deals with possibilities of utilizing dislocation structures as active components of devices. The suggested means for controlled formation of dislocations is direct wafer bonding, giving rise to well defined dislocation networks with adjustable properties. It is shown that the networks allow building light emitting diodes based on the D line luminescence of the dislocations. A light emitter at about 1.5 mm wavelength is demonstrated, with an efficiency potential estimated at 1%. Immobilization of biomolecules on Si surfaces by Coulomb interaction with the dislocations in the network is another application discussed. Finally, the potential use of dislocation networks as insulating layers permeable to impurities to be gettered and as three-dimensional buried conductive channels in the Si wafer is addressed.