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Reliability, Testing, and Characterization of MEMS/MOEMS III
DOI: 10.1117/12.524441
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Testing silicon MEMS structures subjected to thermal loading by digital holography
Proceedings article published in 2004 by
Pietro Ferraro,
Sergio De Nicola,
Giuseppe Coppola 
,
Andrea Finizio,
Mario Iodice,
Carlo Magro,
Giovanni Pierattini
,
Andrea Finizio,
Mario Iodice,
Carlo Magro,
Giovanni Pierattini
This paper was not found in any repository, but could be made available legally by the author.
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