Published in
Microelectronic Yield, Reliability, and Advanced Packaging
DOI: 10.1117/12.404868
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Test and reliability analysis of PBGA assemblies under random vibration
Proceedings article published in 2000 by
Qingjin Yang,
Zhiping Wang,
Geok H. Lim,
Hock Lye J. Pang,
Fook F. Yap,
Rongming Lin
This paper was not found in any repository, but could be made available legally by the author.
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Preprint: archiving forbidden
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