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Advances in Electronic Packaging, Parts A, B, and C
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Wafer Level Micropackaging for RF MEMS Switches
Proceedings article published in 2005 by
David I. Forehand,
Charles L. Goldsmith
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Abstract
Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package added insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.