Published in
2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)
DOI: 10.1109/memsys.2013.6474270
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CMOS-based thermopiles using vertically integrated double polycrystalline silicon layers
Proceedings article published in 2013 by
Huchuan Zhou,
P. Kropelnicki,
Julius Minglin Tsai,
Chengkuo Lee 
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