Published in
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
DOI: 10.1109/ltb-3d.2014.6886196
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Low temperature metal bonding for 3D and power device packaging
Proceedings article published in 2014 by
L. Di Cioccio,
Y. Beilliard,
S. Mermoz,
R. Estevez,
P. Coudrain,
S. Moreau,
J. Widiez
This paper was not found in any repository, but could be made available legally by the author.
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