Published in
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
DOI: 10.1109/ipfa.2011.5992797
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Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs
Proceedings article published in 2011 by
Riko I. Made 
,
Chee Lip Gan
,
Chee Lip Gan
This paper was not found in any repository, but could be made available legally by the author.
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