Published in
2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects
DOI: 10.1109/imws.2009.4814900
Links
Tools
Impact of the Configuration of Ground Vias on the Performance of Vertical Transitions Used in Electronic Packages
Proceedings article published in 2009 by
Svetlana C. Sejas-Garcia,
Gerardo Romo,
Reydezel Torres-Torres 
This paper was not found in any repository, but could be made available legally by the author.
Full text: Unavailable
Published version:
archiving forbidden
Data provided by 