Published in
2012 IEEE International Interconnect Technology Conference
DOI: 10.1109/iitc.2012.6251646
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Compact modeling and performance optimization of 3D chip-to-chip interconnects with transmission lines, vias and discontinuities
Proceedings article published in 2012 by
Vachan Kumar,
Rohit Sharma,
Jikai Chen,
Abhimanyu Kapoor,
Rizwan Bashirullah,
Paul Kohl,
Azad Naeemi 
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