Published in
3rd Electronics System Integration Technology Conference ESTC
DOI: 10.1109/estc.2010.5642808
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Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS)
Proceedings article published in 2010 by
Julian Kahler,
Nicolas Heuck,
Gerhard Palm,
Andrej Stranz,
Andreas Waag,
Erwin Peiner 
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