Published in
2009 11th Electronics Packaging Technology Conference
DOI: 10.1109/eptc.2009.5416485
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Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applications
Proceedings article published in 2009 by
H. Yan,
Y. Y. Tay,
M. H. Liang,
Z. Chen,
C. M. Ng,
J. S. Pan,
H. Xu,
C. Liu,
V. V. Silberschmidt 
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