Published in
2007 IEEE Electrical Performance of Electronic Packaging
DOI: 10.1109/epep.2007.4387161
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Power Delivery for 3D Chip Stacks: Physical Modeling and Design Implication
Proceedings article published in 2007 by
Gang Huang,
Muhannad Bakir,
Azad Naeemi 
,
Howard Chen,
James D. Meindl
,
Howard Chen,
James D. Meindl
This paper was not found in any repository, but could be made available legally by the author.
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