Dissemin is shutting down on January 1st, 2025

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1992 Proceedings 42nd Electronic Components & Technology Conference

DOI: 10.1109/ectc.1992.204230

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The 3D stack in short form (memory chip packaging)

Proceedings article published in 2003 by J. A. Minahan, A. Pepe, R. Some, M. Suer
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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Preprint: archiving allowed
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Published version: archiving forbidden
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