Published in
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
DOI: 10.1109/3dic.2012.6262952
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Chip-level TSV integration for rapid prototyping of 3D system LSIs
Proceedings article published in 2012 by
K. Hozawa,
F. Furuta,
Y. Hanaoka,
M. Aoki,
K. Takeda,
K. Sakuma,
Kang Wook Lee,
T. Fukushima 
,
M. Koyanagi
,
M. Koyanagi
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