A near-field electrospray process is developed to deposited micro-patterns. Compared with conventional electrospray, near field electrospray uses a steel probe instead of capillary nozzle, and its nozzle-to-substrate distance is shortened to several millimeters to realize micro-scale deposition area. The liquid is supplied by discretely dipping the probe into solution in advance so that electrospray process maintains until the consumption of liquid adhered at the probe tip. The influence of solution conductivity and applied voltage on deposition are investigated, as increasing solution conductivity and high applied voltage may promote the electrospray process and enlarge the line width. In addition, micro-patterns with various materials are directly electrosprayed.