Published in
ECS Meeting Abstracts, 29(MA2013-02), p. 2067-2067, 2013
DOI: 10.1149/ma2013-02/29/2067
The Electrochemical Society, Journal of The Electrochemical Society, 12(160), p. D3051-D3056
DOI: 10.1149/2.010312jes
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Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism
Journal article published in 2013 by
Liu Yang,
Aleksandar Radisic,
Johan Deconinck 
,
Philippe M. Vereecken
,
Philippe M. Vereecken
This paper is made freely available by the publisher.
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