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American Society of Mechanical Engineers, Journal of Manufacturing Science and Engineering, 3(125), p. 628

DOI: 10.1115/1.1557297

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Deposition of Diamond in Copper by Triboadhesion

Journal article published in 2003 by J. M. Rodrı´guez Lelis, J. Colı´n Ocempo, J. Porcayo Caldero´n ORCID, J. M. Robles
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.