Published in
Springer Verlag, Microsystem Technologies, 5(16), p. 863-870
DOI: 10.1007/s00542-010-1035-7
Links
Tools
Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process
Journal article published in 2010 by
Ü. Sökmen,
A. Stranz,
S. Fündling,
S. Merzsch,
R. Neumann,
H.-H. Wehmann,
E. Peiner 
,
A. Waag
,
A. Waag
This paper was not found in any repository, but could be made available legally by the author.
Full text: Unavailable
Published version:
archiving forbidden
Data provided by 