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Proceedings of the 6th International Symposium on Power Semiconductor Devices and Ics
DOI: 10.1109/ispsd.1994.583746
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Influence of the mechanical conditions on the electrical and structural properties of the interface between directly bonded silicon wafers
Proceedings article published in 1970 by
A. Laporte,
G. Sarrabayrouse,
L. Lescouzeres,
A. PeyreLavigne,
M. Benamara,
A. Rocher,
A. Claverie
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