Published in
Springer Verlag, Welding in the World, 3(59), p. 427-432
DOI: 10.1007/s40194-014-0216-x
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Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications
Journal article published in 2014 by
Jianfeng Yan,
Guisheng Zou,
Lei Liu 
,
Dongyue Zhang,
Hailin Bai,
Ai-Ping Wu,
Y. Norman Zhou
,
Dongyue Zhang,
Hailin Bai,
Ai-Ping Wu,
Y. Norman Zhou
This paper was not found in any repository, but could be made available legally by the author.
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