Dissemin is shutting down on January 1st, 2025

Published in

Springer (part of Springer Nature), Journal of Materials Science: Materials in Electronics, 3(26), p. 1940-1949

DOI: 10.1007/s10854-014-2633-4

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Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape

Journal article published in 2014 by Ping Chen, Xiuchen Zhao ORCID, Yong Wang, Ying Liu, Hong Li, Yue Gu
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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