The fabrication of electrodes is one of the key techniques in constructing thermoelectric elements for the practical applications. In this work, the commercial active brazing alloy “Incusil-ABA” was used for the joining of CoSb3 to the Cu surface of the graded electrode materials (Cu/AlN/Cu) by using spark plasma sintering (SPS). The bonding was performed in vacuum at temperatures 500°C for 10min. The brazing and diffusion bonding process were investigated by analyzing the crystal structure and microstructure of the bonding interface using X-ray diffraction and scanning electron microscopy, and its composition distribution was also analyzed by energy dispersive X-ray.