Published in

Elsevier, Microelectronic Engineering, (141), p. 56-61, 2015

DOI: 10.1016/j.mee.2014.11.025

Links

Tools

Export citation

Search in Google Scholar

Residual layer-free reverse nanoimprint lithography on silicon and metal-coated substrates.

This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Orange circle
Postprint: archiving restricted
Red circle
Published version: archiving forbidden
Data provided by SHERPA/RoMEO

Abstract

In this work we demonstrate that Reverse Nanoimprint Lithography is a feasible and flexible lithography technique applicable to the transfer of micro and nano polymer structures with no residual layer over areas of cm2 areas on silicon, metal and non-planar substrates. We used a flexible polydimethylsiloxane stamp with hydrophobic features. We present residual layer-free patterns imprinted using a commercial poly(methylmethacrylate) thermoplastic polymer over silicon, nickel and pre-patterned substrates. Our versatile patterning technology is adaptable to free form nano structuring and has coupling to adhesion technologies. ; The support of the project PLAST-4-FUTURE funded by the European Commission (FP7-2012-NMP-ICT-FoF) under Grant Agreement number 314345 (www.plast4future.eu) and of the national project MAT-2012-31392 TAPHOR are gratefully acknowledged. ; Peer Reviewed