Published in
Elsevier, Materials & Design, (64), p. 15-20
DOI: 10.1016/j.matdes.2014.07.035
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Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders
Journal article published in 2014 by
L. F. Li,
Y. K. Cheng,
G. L. Xu,
E. Z. Wang,
Z. H. Zhang,
H. Wang 
This paper is made freely available by the publisher.
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