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American Scientific Publishers, Nanoscience and Nanotechnology Letters, 1(1), p. 13-16

DOI: 10.1166/nnl.2009.005

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Effect of Bias Sputtering on Step Coverage of Thin Tantalum-Based Copper Barriers

Journal article published in 2009 by Yu-Sheng Wang, Wen-Hsi Lee, Ying-Lang Wang, Din-Yuen Chan, Shih-Chieh Chang
Distributing this paper is prohibited by the publisher
Distributing this paper is prohibited by the publisher

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