Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 10(5), p. 1432-1440, 2015
DOI: 10.1109/tcpmt.2015.2452221
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Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis
Journal article published in 2015 by
John N. Myers,
Xiaoxian Zhang,
Yonghao Xiu,
Yuying Wei,
Jaimal M. Williamson,
Kang-Wook Lee,
Zhan Chen 
This paper was not found in any repository, but could be made available legally by the author.
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