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Materials Research Society, Materials Research Society Symposium Proceedings, (614), 2000

DOI: 10.1557/proc-614-f7.7.1

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Large Anisotropy Via Oblique Sputtering of Ta Underlayers

Journal article published in 2000 by J. E. Bonevich, R. D. McMichael ORCID, C. G. Lee, P. J. Chen, W. Miller, W. F. Egelhoff
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

ABSTRACTAnisotropy fields in excesss of 120kA/m(1500Oe)have been produced in 3 nm to 5 nm thick polycrystalline films of Co with Ta underlayers. The unusualy high anisotropy is magnetostatic in origin, and is induced by corrugations on the surface of an obliquely sputtered Ta underlayer. Cross-sectional TEM reveas 8 nm columnar grains of Ta tilted toward the Ta source and elongated perpendicuar to the Ta flux in the film plane. The anisotropy field of the Co film increases with both the underlayer thickness and the angle between theTa source and the film normal. In spin valve samples, the anisotropy is attenuated by more than an order of magnitude across a 4nm thick Cu spacer. Magnetoresistance measurements on a spin valve indicate less than 2° dispersion in hard axis directions, and despite the nanometer-scale roughness of the underlayer, there is weak broadening of the ferromagnetic resonance line.