Published in
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
DOI: 10.1109/icept.2015.7236824
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Electrical simulation of gold bonding wire with different parameters
Proceedings article published in 2015 by
Dejing Wang,
Yuanfu Zhao,
Quanbin Yao,
Yusheng Cao,
Binhao Lian,
Hongshuo Zhang
This paper was not found in any repository, but could be made available legally by the author.
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