Published in
Elsevier, Microelectronic Engineering, (106), p. 149-154
DOI: 10.1016/j.mee.2013.01.020
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Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits
Journal article published in 2013 by
Riko I. Made 
,
Peng Lan,
Hong Yu Li,
Chee Lip Gan,
Chuan Seng Tan
,
Peng Lan,
Hong Yu Li,
Chee Lip Gan,
Chuan Seng Tan
This paper is available in a repository.
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