Published in
Elsevier, Surface and Coatings Technology, (251), p. 69-73, 2014
DOI: 10.1016/j.surfcoat.2014.04.005
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Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process
Journal article published in 2014 by
Lai-Ma Luo,
Ze-Long Lu,
Xin-Min Huang,
Xiao-Yue Tan 
,
Xiao-Yu Ding,
Ji-Gui Cheng,
Liu Zhu,
Yu-Cheng Wu
,
Xiao-Yu Ding,
Ji-Gui Cheng,
Liu Zhu,
Yu-Cheng Wu
This paper was not found in any repository, but could be made available legally by the author.
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