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Elsevier, Journal of Alloys and Compounds, (600), p. 21-28, 2014
DOI: 10.1016/j.jallcom.2014.02.054
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Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint
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