Published in
Elsevier, Materials Letters, 4(59), p. 503-509
DOI: 10.1016/j.matlet.2004.10.034
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Photoimageable silver paste for high density interconnection technology
Journal article published in 2005 by
G. G. Umarji,
S. A. Ketkar,
G. J. Phatak,
T. Seth,
U. P. Mulik,
D. P. Amalnerkar 
This paper was not found in any repository, but could be made available legally by the author.
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