Published in
Institute of Electrical Engineers of Japan, Denki Gakkai Ronbunshi. E, Sensa, Maikuromashin Bumonshi / IEEJ Transactions on Sensors and Micromachines, 9(134), p. 284-289, 2014
Links
Tools
Effect of Bonding Pressure on the Strength of Cu/Cu Direct Bonding by Surface Activated Method
Journal article published in 2014 by
Jun Utsumi,
Yuko Ichiyanagi 
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
Full text: Unavailable
Data provided by 