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Springer (part of Springer Nature), Journal of Materials Science: Materials in Electronics, 12(26), p. 9387-9395
DOI: 10.1007/s10854-015-3151-8
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Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder
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