Published in
Korean Institute of Metals and Materials, Taehan K¿¿¿¿msok, Chaeryo Hakhoe Chi ==, 7(53), p. 495-499
DOI: 10.3365/kjmm.2015.53.7.495
Links
Tools
Shape Change of Cu Pillar Solder Bump During Reflow Process and Its Modeling
Journal article published in 2015 by
Hyo-Jong Lee,
Sang-Hyuk Kim,
Han-Kyun Shin,
Chae-Min Park,
Dong-Uk Kim,
Pil-Ryung Cha,
Ui-Hyoung Lee
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
Full text: Unavailable
Data provided by 