Purpose – The paper aims to show application of the electrochemically deposited coatings for thickening of the screen printed electric paths potentially applied in photovoltaic cells. Design/methodology/approach – The electric paths were screen printed with the use of silver-based paste. The paths were thickened by electrodeposition of thin copper layer in potentiostatic regime from surfactant-free plating bath. The morphology and surface quality of the paths were studied by imaging with scanning electron microscopy. Findings – The electric paths can be thickened successfully, but quality for the screen printed substrate determines quality of deposited layer. The EDX analysis confirmed that the deposited copper layer covered uniformly the printed paths. Research limitations/implications – The adhesion of the copper-covered path to the silicon wafer surface depends on adhesion of the original screen printed path. Originality/value – This paper confirms that electrodeposited copper can be applied for screen printed silver paths thickening in a controllable way.