Published in
Elsevier, Microelectronics Reliability, 7(51), p. 1203-1206
DOI: 10.1016/j.microrel.2011.02.024
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Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD
Journal article published in 2011 by
A. Wiatrowski,
W. M. Posadowski,
G. Jóźwiak,
J. Serafińczuk 
,
R. Szeloch,
T. Gotszalk
,
R. Szeloch,
T. Gotszalk
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