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Springer (part of Springer Nature), Journal of Electronic Materials, 12(38), p. 2429-2435

DOI: 10.1007/s11664-009-0871-7

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Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

Journal article published in 2009 by Jicheng Gong, Paul P. Conway, Changqing Liu, Vadim V. Silberschmidt ORCID
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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