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Journal of Japan Institute of Electronics Packaging, 2(16), p. 152-158

DOI: 10.5104/jiep.16.152

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Electroless Pattern Copper Plating on PET Film Using Nano-Dispersion of Polypyrrole

Journal article published in 2013 by Hiroki Ashizawa, Shin-Ichiro Kato ORCID, Yosuke Nakamura
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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