Published in

Trans Tech Publications, Materials Science Forum, (514-516), p. 483-489, 2006

DOI: 10.4028/www.scientific.net/msf.514-516.483

Trans Tech Publications, Materials Science Forum, p. 483-489

DOI: 10.4028/0-87849-402-2.483

Links

Tools

Export citation

Search in Google Scholar

Joining of Gamma-Based Titanium Aluminides – A Review

This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

Full text: Download

Red circle
Preprint: archiving forbidden
Red circle
Postprint: archiving forbidden
Green circle
Published version: archiving allowed
Data provided by SHERPA/RoMEO

Abstract

The optimisation of joining technologies is essential to the application of advanced materials in the design of parts and devices. The development of intermetallic compounds, as structural materials, inevitably requires a new approach to join these compounds to themselves or to other materials. Among different intermetallic classes, titanium aluminides are one of the most studied. However, the industrial application is far from being proportional to the research, due to different problems, where joining processes have an important role. The present paper highlights the state of art on joining γ-TiAl alloys. A review is presented with special emphasis on solid-state diffusion bonding process, because it seems to be the most suitable technique to produce high quality joints of advanced materials. The influence of the bonding conditions on the physical and mechanical properties of the joints is highlighted and the introduction of single or multiple interlayers to assist in the bonding process is discussed. A novel approach developed by the authors to the solid-state diffusion bonding of γ-TiAl alloys using Ti/Al multilayer thin films as bonding materials is proposed. The improvement of the solid-state diffusion bonding will induce sound joints at lower temperatures or pressures.