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Chevolleau et al., 2011
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@inproceedings{Chevolleau2011, abstract = {International audience}, author = {Chevolleau, T. and Chave, F. and David, T. and Posseme, N. and Vallier, L. and Pargon, E. and Darnon, M. and Bailly, F. and Joubert, O. and Bouyssou, R. and Barnola, S. and Ducote, J. and Gouraud, P. and Verove, C.}, month = {jan}, title = {Plasma Etching Challenges for Porous SiOCH Integration In Advanced Interconnect Levels}, year = {2011} }
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Plasma Etching Challenges for Porous SiOCH Integration In Advanced Interconnect Levels
Proceedings article published in 2011 by
T. Chevolleau
,
F. Chave
,
T. David
,
N. Posseme
,
L. Vallier
,
E. Pargon
,
M. Darnon
,
F. Bailly
,
O. Joubert
,
R. Bouyssou
,
S. Barnola
,
J. Ducote
,
P. Gouraud
,
C. Verove
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Abstract
International audience