Published in
2010 IEEE International Interconnect Technology Conference
DOI: 10.1109/iitc.2010.5510735
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Etching Process Scalability and Challenges for ULK Materials
Proceedings article published in 2010 by
T. Chevolleau,
N. Posseme,
T. David,
R. Bouyssou,
J. Ducote,
F. Bailly,
M. Darnon 
,
M. El Kodadi,
M. El Kodadi,
M. Besacier,
C. Licitra,
M. Guillermet,
A. Ostrovsky,
C. Verove,
O. Joubert
,
M. El Kodadi,
M. El Kodadi,
M. Besacier,
C. Licitra,
M. Guillermet,
A. Ostrovsky,
C. Verove,
O. Joubert
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