The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential. The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work. Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were successfully developed building a European platform on 3D Integration. This is considered to be essential output of the e-CUBES project. These are in the 3D integration categoriesVertical System Integration (3D-SOC): Fraunhofer IZM-M's Through-Si Via (TSV) Technology (ICV-SLID) and SINTEF's Hollow Via & Gold Stud Bump Bonding (HoViGo),Chip Stacking (3D-WLP): IMEC / Fraunhofer IZM's Thin-Chip-Integration Technology (TCI/UTCS) and CEA-LETI's Via Belt Technology, and3D Assembly (3D-SIP): 3D-PLUS' High Performance Package-in-Package (HiPPiP) and Wireless Die-on-Die (WDoD) Technologies, as well as Tyndall's Submicron Wire Anisotropic Conductive Film Technology (SW-ACF). Four optimized 3D integration technologies were successfully used in the development of three e-CUBES application demonstrators: Thin-Chip-Integration technology (TCI/UTCS) for Philips' Health & Fitness demonstrator, TSV technology ICV-SLID and HoViGo for Infineon's Automotive demonstrator (TPMS) and Package-in-Package technology HiPPiP for Thales' Aeronautic demonstrator. The 3D integration technologies which form part of the established e-CUBES platform will be presented including key characteristics, critical dimensions, electrical parameters and adaptability to new applications.