Published in
American Scientific Publishers, Journal of Nanoelectronics and Optoelectronics, 4(10), p. 504-508
Links
Tools
The Effect of Bi/Sn Ratio of Bi–Sn–Ag Solder on the Mechanical and Electrical Properties of Interfaces Between Solder/Thermoelectric Material and Solder/Electrode
Journal article published in 2015 by
Jun-Young Cho,
Seunghyun Ahn,
Sung-Hwan Bae,
Gwi-Rang Kim,
Jae-Hun Han,
Deuk-Hee Lee,
Jin-Sang Kim,
Kyu Jeong Song,
Chan Park
Distributing this paper is prohibited by the publisher
Full text: Unavailable
Preprint: archiving forbidden
Postprint:
archiving forbidden
Published version:
archiving forbidden
Data provided by 