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ECS Meeting Abstracts, 27(MA2010-02), p. 1746-1746, 2010

DOI: 10.1149/ma2010-02/27/1746

The Electrochemical Society, ECS Transactions, 4(33), p. 441-449, 2010

DOI: 10.1149/1.3483534

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Properties of Interfacial Dislocations in Hydrophobic Bonded Si-Wafers

Journal article published in 2010 by Manfred Reiche, Martin Kittler, Angelika Haehnel, T. Arguirov, T. Mchedlidze ORCID
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Abstract

The realization of defined dislocation networks by hydrophobic wafer bonding allows the characterization of electrical and optical properties of dislocations. The present paper investigates the electrical properties in samples containing only a few (up to 6) dislocations. By taking results of other analysis into account the electronic properties of individual dislocations can be described. The dislocation-induced luminescence between 1.3 mu m and 1.5 mu m was also analyzed using different types of light-emitting diodes (LED). It was shown that the emission depends on the structure of the dislocation network.