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American Institute of Physics, Applied Physics Letters, 5(93), p. 053504

DOI: 10.1063/1.2969282

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Inversion-channel GaN metal-oxide-semiconductor field-effect transistor with atomic-layer-deposited Al2O3 as gate dielectric

This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

Inversion n -channel GaN metal-oxide-semiconductor field-effect-transistors (MOSFETs) using atomic-layer-deposited Al 2 O 3 as a gate dielectric have been fabricated, showing well-behaved drain I-V characteristics. The drain current was scaled with gate length (varying from 1 to 16 μ m ), showing a maximum drain current of ∼10 mA / mm in a device of 1 μ m gate length, at a gate voltage of 8 V and a drain voltage of 10 V . At a drain voltage of 0.1 V , a high I on /I off ratio of 2.5×105 was achieved with a very low off-state leakage of 4×10-13 A /μ m . Both MOSFET and MOS capacitor showed very low leakage current densities of 10-8 A / cm 2 at biasing fields of 4 MV / cm . The interfacial density of states was calculated to be (4–9)×1011 cm -2 eV -1 near the midgap.