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IOP Publishing, Japanese Journal of Applied Physics, 6S(31), p. 1972, 1992

DOI: 10.1143/jjap.31.1972

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Low-Temperature Growth of SiO2Thin Film by Photo-Induced Chemical Vapor Deposition Using Synchrotron Radiation

This paper is available in a repository.
This paper is available in a repository.

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Abstract

SiO2 thin films have been grown on Si and MgF2 wafers at low temperatures in the range of room temperature (R.T.)-200°C by photo-induced chemical vapor deposition (photo-CVD) using synchrotron radiation (SR). The thin films grow selectively on the irradiated area. Deposition rate at R.T. is about 8-13 nm/min, and depends on the electron beam current of SR. The thin films deposited even at R.T. have few impure Si-H and Si-OH bonds, because source gases are decomposed and react effectively, in the vapor phase and on the substrate surface by the SR light. The minimum fixedoxide-charge density is 1.6×1011 cm-2 in SiO2 film of thickness 92 nm deposited at R.T. This density is low in comparison with those of films deposited at low temperature by the other CVD methods.