Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated < 0.1 dB package insertion loss up through 110 GHz and accounts for only 28 % of the total packaged RF MEMS circuit cost. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.