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Published in

Elsevier, Composites Science and Technology, 10(67), p. 2036-2044

DOI: 10.1016/j.compscitech.2006.11.017

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CuO nanoparticle filled vinyl-ester resin nanocomposites: Fabrication, characterization and property analysis

Journal article published in 2007 by Zhanhu Guo, Xiaofeng Liang, Tony Pereira, Roberto Scaffaro ORCID, H. Thomas Hahn
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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Data provided by SHERPA/RoMEO

Abstract

Both unmodified cupric oxide (CuO) nanoparticles and those functionalized with a bi-functional coupling agent methacryloxypropyl-trimethoxysilane (MPS) were used to fabricate vinyl-ester resin polymeric nanocomposites. The nanoparticle functionalization was observed to have a significant effect on the physical properties of the cupric oxide filled vinyl-ester resin nanocomposite. Thermal degradation study by thermo-gravimetric analysis (TGA) showed the increased thermo-stability in the functionalized-nanoparticle-filled vinyl-ester resin nanocomposites as compared with the unmodified-nanoparticle-filled counterparts. The more uniform particle dispersion and the chemical bond between nanoparticle and vinyl-ester resin were found to contribute to the increased thermal stability and enhanced tensile strength.