Published in
Elsevier, Materials Letters, (134), p. 184-186, 2014
DOI: 10.1016/j.matlet.2014.07.061
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Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints
Journal article published in 2014 by
Wei-Yu Chen,
Wei Tu 
,
Hsiang-Ching Chang,
Tzu-Ting Chou,
Jenq-Gong Duh
,
Hsiang-Ching Chang,
Tzu-Ting Chou,
Jenq-Gong Duh
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